tape ball grid array package

专利摘要:
PURPOSE: A TBGA(Thermal enhanced Ball Grid Array) package is provided to enhance the adhesive force between a tap tape a heat spreader and the adhesive force between a ground plate and the heat spreader by performing a black oxide process having a structure of a circular vertical projection on a ground plate formed with copper. CONSTITUTION: A TBGA includes a semiconductor chip, a substrate, a heat spreader, a bonding wire, a sealant, and a conductive ball. A method for adhering a tap tape, the heat spreader, the ground plate, and the heat spreader includes a black oxide process having a structure of a circular vertical projection on the ground plate.
公开号:KR20040061847A
申请号:KR1020020088147
申请日:2002-12-31
公开日:2004-07-07
发明作者:배동수；김영철；김근식；이구홍
申请人:주식회사 칩팩코리아；
IPC主号:

专利说明:

TV ball package {tape ball grid array package}
[6] BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package. More particularly, the present invention relates to a reliable TV package by improving adhesion between the tape and the ground plate.
[7] In the field of semiconductor package manufacturing, it is known to apply tape automated bonding (TAB). TAB tape is a tape having an adhesive layer and an insulating layer so that a predetermined circuit pattern can be formed thereon, which is provided on a heat spreader together with a semiconductor chip. In this case, the bonding pad of the semiconductor chip is electrically connected to the circuit pattern of the tape tape through wire bonding.
[8] In general, a heat sink may be installed in a tape ball grid array semiconductor package to quickly dissipate heat generated when a powered semiconductor chip is operated to the outside of the package. The radiator includes a heat dissipation block (not shown), a heat spreader made of copper (Cu) material vacuum-absorbed to the heat dissipation block, and a ground plate bonded to the heat spreader.
[9] A semiconductor package using the tap tape and heat spreader, such as a Thermal Enhanced Ball Grid Array semiconductor package, can accommodate high density circuits, has excellent electrical characteristics, and has high heat dissipation. It is mainly used for custom products such as cards, game cards, etc.
[10] 1 is a view showing an attachment process between a tap tape and a heat spreader in a TV package according to the prior art.
[11] 2 is a view illustrating an attachment process between a ground plate and a heat spreader in a TV package according to the related art.
[12] In general, in order to manufacture a TVA semiconductor package, as illustrated in FIGS. 1 and 2, a step tape 10 having a bonding pad of a semiconductor chip (not shown) and a circuit pattern (not shown) wire-bonded thereto may be used. This involves the attaching process of the heat spreader and the attaching process of the ground plate 20 and the heat spreader 30, respectively.
[13] The attachment process is carried out by the compression method by the roller 40.
[14] As shown in FIG. 1, the attaching process of the tape tape I and the heat spreader 30 uses a black oxide technology having a vertical protrusion structure. The black oxide technology has a high adhesion.
[15] The attaching process of the ground plate 21 and the heat spreader 30 uses a gray oxide technology, as shown in FIG. 2. The gray oxide technology is protected from particles such as stains generated during the deposition process. At this time, reference numeral 21 denotes a ground plate to which the tape is attached.
[16] 3 and 4 are SEM photographs for explaining the problem according to the prior art.
[17] 3 is a SEM photograph showing that particles such as stains are generated when using black oxide having a vertical protrusion structure.
[18] In addition, Figure 4 is a SEM photograph showing that the delamination phenomenon occurs at high temperatures when using gray oxide.
[19] However, in the prior art, when the black oxide is used to attach the tape to the tape and the heat spreader, as shown in FIG. 3, the adhesion is improved rather than the gray oxide, but in the subsequent plating process due to particles such as stains. There was a problem that causes pollution and affects during the wire bonding process.
[20] In addition, when the gray oxide is used to attach the ground plate and the heat spreader, as shown in FIG. 4, the adhesion is weaker than that of the black oxide having a layered structure, but is protected from particles such as stains generated during operation. There was a problem that can not be applied at high temperatures.
[21] Accordingly, the present invention has been made to solve the above-mentioned problems, and in attaching a tape to a heat spreader and a ground plate and a heat spreader, the semiconductor is protected from contamination during operation and made available at high temperatures. The purpose is to provide a method for attaching a package.
[1] 1 is a view showing an attachment process between a tap tape and a heat spreader in a TV package according to the prior art.
[2] FIG. 2 is a view illustrating an attachment process between a ground plate and a heat spreader in a TV package according to the related art. FIG.
[3] 3 and 4 are SEM photographs for explaining the problems according to the prior art.
[4] 5 and 6 are SEM photographs for explaining the method of attaching a semiconductor package according to the present invention.
[5] Figure 7 is a comparison table comparing the force required to peel by oxidation according to the prior art versus the present invention.
[22] In order to achieve the above object, in the attaching method between the step tape and the heat spreader of the semiconductor package and the ground plate and the heat spreader, the present invention is characterized in that the ground plate is subjected to a black oxide treatment having a circular horizontal protrusion structure.
[23] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[24] 5 and 6 are SEM pictures for explaining a method of attaching a semiconductor package according to the present invention.
[25] 5 is an SEM photograph at 1000 times magnification, and FIG. 6 is an SEM photograph at 10,000 magnifications.
[26] The attachment method between the ground plate and the heat spreader according to the present invention, as shown in Figures 5 and 6, to the surface of the heat spreader
[27] The copper plate of the ground plate is subjected to black oxide treatment with a circular vertical protrusion structure.
[28] Therefore, the black oxide treatment having a circular horizontal protrusion structure improves adhesion between the tap tape and the heat spreader and the ground plate and the heat spreader, has good reliability at high temperatures, and hardly generates particles such as stains generated during operation. .
[29] Figure 7 is a comparison table comparing the force required to peel by oxidation according to the prior art versus the present invention.
[30] As shown in FIG. 7, the black oxide having a circular horizontal protrusion according to the present invention has better adhesive strength than the conventional gray oxide, and has no better adhesive strength than the black oxide having the vertical vertical protrusion.
[31] However, since the black oxide having a circular horizontal protrusion according to the present invention has a finer surface structure than gray oxide, it has good reliability even at high temperatures.
[32] According to the present invention, in order to attach the tape to the heat spreader and the ground plate and the heat spreader, a black oxide treatment having a circular horizontal protrusion is applied to the ground plate, so that it has excellent adhesion even at high temperatures, and remarkably generates particles such as stains. Can be reduced.
[33] As described above, in the present invention, a black oxide treatment having a circular vertical protrusion structure is applied to the ground plate made of copper, thereby improving adhesion between the tap tape and the heat spreader and the ground plate and the heat spreader, and protecting it from particles such as stains. can do. In addition, there is an advantage that can be applied to a process requiring a high temperature.
[34] In addition, this invention can be implemented in various changes within the range which does not deviate from the summary.

权利要求:
Claims (1)
[1" claim-type="Currently amended] In the tape tape and heat spreader of the semiconductor package and the attachment method between the ground plate and the heat spreader,
And attaching the ground plate to a black oxide treatment having a circular horizontal protrusion structure.

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同族专利:

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公开号 | 公开日

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KR100507286B1|2005-08-09|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2002-12-31|Application filed by 주식회사 칩팩코리아

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2002-12-31|Priority to KR20020088147A

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2004-07-07|Publication of KR20040061847A

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2005-08-09|Application granted

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2005-08-09|Publication of KR100507286B1

优先权:

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申请号 | 申请日 | 专利标题

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KR20020088147A|KR100507286B1|2002-12-31|2002-12-31|Method for adhering semiconductor package|